products > PARAMETRIC (WAT) PROBE CARD

STAr Virgo-SEMI is high performance probe card with ultra-low leakage current and parasitic capacitance for engineering probe station with 115 mm width probe card holder and highly suitable for SPICE modeling tests, device characterization, reliability qualification, etc.

STAr Virgo-PRO II is production-level probe cards for used with Keysight 4070/4080 series parametric testers in electrical/wafer acceptance tests and enables consistent probing of small pads at high temperature for testing low-level current below 1.0 pA accurately.

STAr Virgo-PRO K is an advanced production-level probe cards for used with Keysight 4070/4080 series parametric testers for wafer acceptance tests of nanometer fabrication processes.

STAr Virgo-RPO Z is the leading parametric probe cards for testing advanced nanometer semiconductor devices with pads below 30 um square and less than 100 fA leakage current at temperature up to 200 degC.

STAr Virgo PRO 62 is the cost-effective probe card extents the useful life of legacy Keysight 4062 testers for probing advanced semiconductor devices enabling low leakage current measurements and small pads probing.

STAr Virgo-KS6 is Keithley S600 series tester probe cards used for production level electrical and wafer acceptance tests and constructed of high rigidity multi-layered ceramic PCB enabling high quality probing of small pads.

STAr Virgo-PRO II-HT/UT is production-level probe cards used with Keysight 4070 series parametric testers in reliability tests capable for wafer test up to 150 degC (HT) and 200 degc (UT).  

STAr Virgo-PRO II-ET is production-level probe cards for used with Keysight 4070 series parametric testers in reliability and burn-in tests capable for wafers tests of up to 300 degC.  

STAr Virgo-SEMI-UT is engineering-level probe cards used with parametric test instruments and engineering probers for wafer-level reliability tests of up to 200 degC.

STAr Virgo-SEMI-ET Virgo-SEMI-ET is used in engineering environment for wafer-level reliability tests of up to 300 degC with parametric instruments and engineering probe station.  

STAr Virgo-PRO/SEMI-XT enables wide temperature range parametric and reliability test from -65 degC to 300 degC (400 degC option) from more than 1000 hrs continuously.

STAr Virgo SEMI-HFx is a wide bandwidth cantilever-type probe cards for engineering and production high-speed (sub-ns rise time) parametric tests such as fast-BTI, Pulsed-IV, Flash memory, RAM, etc.

STAr Virgo-HF employs high frequency coaxial probes with SMA connectors for high speed/frequency signal transfer, and STAr will also design accompanying DC probes for ground connections so as to ensure good shielding and return paths for high speed/frequency signals.

STAr Virgo-RF employs high frequency GSG, GS or SG probes with 2.4 mm connectors for RF source and measurements. STAr can further deploy low-leakage DC probes for on-pass DC-RF tests especially used with Keysight 4080 series advanced parametric testers.

STAr Virgo-hiVIP is probe card for use with high voltage, current and power devices such as IGBT, DMOS, BJT, etc. Virgo-hiVIP with “Smart-Clamp” technology is constructed with passive and active devices befitted for testing power devices of up to 10 kV and/or 20 A.

STAr Virgo PRO-XV probe card is applicable for high voltage testing of automotive ICs, AC-DC convertors, power MOSFETs, IGBTs, etc. st voltage, sustaining up to 15KV at 1000um probe spacing without arcing or breakdown at leakage current of <0.1pA/V. 

STAr Virgo-ST is a special thermal probe card used for ensuring the parametric testers and probe card are under controlled environment while the wafer is under high or low temperature probing. This thermally stable environment also ensures that the parametric tester is within the specification temperature and test accuracies are guaranteed.

STAr partners with our customers to develop specialized probe cards for any applications and test environments. With patented technologies and strengths in ceramic PCB, small pad probing, high isolation, frequency, etc., STAr has been in the forefront of parametric/reliability test probe cards.

STAr Cancer-HIC probe card is used extensively in the laser trimming of MLC chip resistor and parallel probing of hybrid integrated circuits such as power transistors, diodes, etc. This probe card has extremely low contact resistance and available with Kelvin (4-wire) type probing enabling very accurate resistance measurements.

STAr Capricorn-MS 4-axes positioner 16-site probe station applies Virgo-MULTI probe card for high temperature low-leakage current advanced wafer-level reliability tests. These cost-effective probe cards can be easily attached to the multi-site Capricorn-MS positioner with temperature of up to 300 degC and pad size down to 35 um sq. 

STAr Virgo-MF probe card supports a maximum of 300mm wafer one touch-down multi-site probing with down to 70um pitch and 50 um sq. pad size devices. Options for up to 350 degC high temperature multi-sit wafer level reliability (WLR) tests with below pic-ampere level leakage current.

STAr Virgo-MP is the probe card used with STAr Capricorn-MP 6-axes multi-site positioner and highly suitable for flexible multi-site probing in wafer-level reliability tests. The Capricorn-MP with Virgo-MP can be placed directly onto Cascade or Suss engineering probe station without the need for expensive probe card holders.