NEWS & EVENTS > NEWS > ARCHIEVE 2021
2021.11.23
STAr Aries Prima 3D MEMS Micro-Cantilever Probe Card for CMOS Sensor Test
Hsinchu, Taiwan - The increasing demands of 5G smartphones, video devices, vehicle camera systems, and other embedded camera technologies in 2021 drive up CMOS image sensor (CIS) testing requirements. To provide the best probing solution for the advanced CIS devices, STAr Technologies’ R&D team has kept refining and developing technology for 3D MEMS Micro-Cantilever probe card and is now introducing a new MEMS probe card to the CMOS image sensor (CIS) test market.
The STAr Aries Prima is an advanced 3D MEMS Micro-Cantilever probe card applicable to CIS devices testing for high-performance parallel Multi-DUT applications. To match the CIS device improvements in resolution, frame rate, and communication speed, the MEMS probe technology applied to the Aries Prima probe card also accommodates minimum probe pitch down to 50um and up to 15,000 pins to support parallel testing up to 64 devices and ensures reliable result while increasing productivity. In addition, this MEMS Micro-Cantilever probe card enables a wide temperature environment from -40 deg. C up to 150 deg. C and testing speed up to 6Gbps for high-speed automatic test.
Dr. Choon-Leong Lou, CTO & CEO of STAr Technologies, comments on this newly developed MEMS probe card, "Currently, MEMS probe card is the mainstream test solution to the semiconductor test industry. We are confident that Aries Prima with 3D MEMS micro-cantilever probe can be the better choice for CMOS wafer sort test and will bring customers more efficient production processes."
STAr Aries Prima probe card for CMOS image sensor testing
2021.11.10
STAr Unicorn LAIT Series Mini- and Micro-LED Test System
Hsinchu, Taiwan - The testing requirements for small pitch Mini- and Micro- LEDs are increasing in response to the growth of new LED displays. STAr Technologies' Unicorn-LAIT series test systems, the advanced high throughput testers, integrate probe station, parallel test instruments, and probe card to meet the mass production needs for Micro-LED and Mini-LED testing.
STAr Unicorn-LAIT series is equipped with EMI shielded chamber for high-speed LED testing in an ultra-low noise environment. Magic-A200e probe station allows alignment of up to 6-inch wafers and automatic test probing with Multi-DUT LED probe cards. The closed-loop XYZ stages and coaxial microscopes provide the best accuracy in multi-LED stepping and high-resolution scanning and probing. In addition, the porous ceramic chuck (with auxiliary chucks) enables cleaning and contact-check to enhance LED test performance and dependable results.
Based on STAr Taurus-LPX high-throughput parametric measurement units (PMUs). The Unicorn-LAIT’s parallel test capacity ranges from 40 to a maximum of 240 LEDs, and with configurable current range per module with a maximum of 5 modules (48 channels per module.) Furthermore, with FPGA firmware control and high-speed ADC, Taurus-LPX can execute high-speed parallel tests to ensure the highest test throughput with good accuracy and repeatability.
Additionally, the STAr Aries µLED probe card is a long-life, Multi-DUT LED test probe card and can perform single touchdowns with 96 probes. The STAr Aries µLED probe card can be optionally configured with a compressed dry air feed (CDA) to clear probing debris and wafer particles. Furthermore, the LED tests can be configured for different requirements such as VF, IF, etc., while a special voltage probe can be configured for ESD testing.
"Unicorn-LAIT series is an advanced integrated tester for cost-effective Micro-LED mass production and truly meets the test requirement for Mini-LED and Micro-LED. Due to the efficient system architecture, STAr Unicorn-LAIT probing solution is suitable for both LED component and optical devices manufacturer and reduces the test cost for customers," said Dr. Choon-Leong Lou, CEO of STAr Technologies.
2021.10.25
STAr Introduces Taurus TS-860x Semiconductor Test Analyzer
Hsinchu, Taiwan - STAr Technologies, a leading supplier in semiconductor systems, announced today the release of a semiconductor test analyzer, the Taurus TS-860x series. This new analyzer is based on the scalable architecture of 5-slot with a maximum of 80 channels per module, 400 channels per system to correspond to industry application and development trends.
The Taurus TS-860x series is configured with a standard expandable interface, ensuring test performance and accurate test data with critical signal integrity. Compared to existing semiconductor test analyzers, the new TS-860x system can be flexibly integrated with per-pin SMU architecture to support DC/AC measurements and reliability test applications such as HCI, NBTI, TDDB, and GOI for devices characteristics. In addition, the Taurus TS-860x system further efficiently reduces measurement costs to meet semiconductor test demand and customized customer requirements.
"Due to the growth in IC demand, the semiconductor test market is increasingly fast-paced. To outpace the market trends, developing new solutions or services to meet customers' requirements is necessary. Taurus TS-860x provides another measurement for both current and even future test needs," said Dr. Choon-Leong, CEO of STAr Technologies.
2021.07.17
STAr Technologies Announces Delivery of Pluto All-In-One Reliability System
Hsinchu, Taiwan - STAr Technologies, a leading supplier in semiconductor parametric and reliability test systems, announces that a top semiconductor manufacturer selected the STAr Pluto Series SMU-per-pin tester and took delivery in the first quarter of 2021 to enhance production efficiency and engineering accuracy. The delivery validates that STAr Pluto Series unique capabilities command the attention of the semiconductor test industry.
The STAr Pluto Series is the next generation All-In-One advanced reliability test system covering all reliability requirements including HCI, BTI, OTF, TDDB, EM for both Wafer and Package-Level tests. The key capabilities surpass the competing reliability testers in the market, including the SMU-per-pin architecture with one-microsecond measurement timing and the complete HCI, GOI, and EM all-in-one reliability test qualification capabilities. These capabilities enable the Pluto Series tester to achieve higher test performance and throughput at lower cost-of-test and significantly increase flexible capacity for industry customers.
In addition to supporting the full range of nanometer node processes and device reliability qualifications, the STAr Pluto Series provides the flexibility for users to develop customized test programs and methodologies based on their own unique needs. Either connected to individually controlled micro-oven modules for DUTs at package or module level, or seamlessly integrated with the STAr multi-site wafer-level probe stations to provide per-pin WLR characterization for technology nodes down to 3-nanometer.
“We are pleased to announce the delivery completed after STAr Pluto Series launched in 4th quarter of 2020. Pluto series is the next generation SMU-per-pin test solution and has revolutionized industry reliability test solutions. In the future, STAr will continue to accelerate the effort to optimize test experience and support customers with the best solutions with measurement results and high performance,“ said Dr. Choon-Leong Lou, CEO of STAr Technologies.
2021.06.02
STAr Technologies Delivers World First Fine-Pitch High-Current MEMS Vertical Probe Card for High-Volume Manufacturing
Hsinchu, Taiwan - STAr Technologies, a leading supplier of semiconductor test systems and probe cards, announces the immediate availability of the Aries-Optima MEMS probe card, the world's first fine-pitch high-current MEMS vertical probe card for high-volume manufacturing. The Aries Optima is the latest pinnacle of MEMS probe card technology, setting new standards, addressing emerging needs in wafer-level testing, and securing STAr as the one of the leaders in MEMS probe card technology.
STAr Technologies has been instrumental in developing and deploying high-value vertical probe technologies for more than a decade and has developed a system and methodology to quickly adapt to emerging market needs. STAr's ongoing commitment to the semiconductor test community is reflected in a 20-year history of regular product introductions that address all aspects of the evolving market needs including enhanced test efficiency, reducing cost of test, optimized test accuracy, and delivery the best value to the market.
In addition to meeting evolving requirements of high-current with probe pitch down to 45μm, the Aries Optima series MEMS probe cards, provides greater value with attributes that maximize return on investment and reduces cost of ownership. STAr has mass produced MEMS probes with carrying capacity of 550mA for standard applications. For automotive and high-power applications, we are able to achieve up to 700mA with test temperatures up to 150degC.
According to a recent VLSI Research report, the demand of ICs continues unprecedented grow due to the economic recovery, 5G and IT infrastructure buildout, among others. These market drivers result in more emphasis on production efficiency and reductions in test time and cost of test, and as a result, MEMS technology probe cards occupy an increasing large market share. The Aries Optima Series MEMS probe card technology ideal for RF, AP, and high-power while providing stable DC performance with better leakage performance than traditional Cobra type probe cards.
“The Aries Optima is the world's first fine-pitch MEMS vertical probe card, supporting high-current test and reducing testing frequency, time and labor cost for customers and will be the best choice for next generation of semiconductor test,” said Dr. Choon-Leong Lou, CEO of STAr Technologies, Inc.
The world's first fine-pitch high-current MEMS vertical probe card for high-volume manufacturing